title
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0821-01-3AE31PA
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0821-01-3AE31PA
  • Part number TE0821-01-3AE31PA
    Product classification Microcontrollers, Microprocessor, FPGA Modules
    description MPSOC MODULE WITH XILINX ZYNQ UL
    encapsulation Bulk
    quantity 200
    price $571.0000
    RoHS status YES
    specifications
    TYPEDESCRIPTION
    MfrTrenz Electronic
    SeriesTE0823
    PackageBulk
    Product StatusACTIVE
    Connector Type2 x 100 Pin
    Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
    RAM Size4GB
    Operating Temperature0°C ~ 85°C
    Module/Board TypeMPU Core
    Core ProcessorZynq UltraScale+ XCZU3CG-1SFVC784E
    Co-ProcessorARM® Cortex®-A53, ARM® Cortex®-R5
    Flash Size128MB